Signamax 065-79EZXMG 1000BaseEZX SFP Module 1550 nm – SM/LC, 110 km

$654.12

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Description

Signamax 065-79EZXMG 1000BaseEZX SFP Module 1550 nm – SM/LC, 110 km

Signamax Small Form-factor Pluggable (SFP) fiber modules come in an array of options supporting Gigabit Ethernet transmission over either multimode or singlemode fiber cable at distances up to 110 kilometers. They adhere to the IEEE 802.3z standards for Gigabit Ethernet fiber connectivity, and are cost-effective methods of providing changeable Gigabit Ethernet fiber optic interfaces to switches and media converters equipped with a standard SFP port. Both standard temperature range (0° C to 70° C) and hardened temperature range (-40° C to 85° C) versions are available.

  • RoHS compliant
  • Meets the SFP Multi-Source Agreement (MSA)
  • Up to 110 km link distance
  • Hot pluggable
  • Metal enclosure for low EMI performance
  • Low power dissipation
  • Router / Server interface
  • Distributed multi-processing
  • Switch to switch interface
  • High speed I/O for file server
Part Number TX/RX
Spectrum		 Light Source Link Power
Budget		 Typical Max. Distance Supply
Voltage		 Operating
Temp.
065-79EZXMG EZX
1550 nm		 DFBLaser 30 dBm 110 km *** 3.3 V 0 ~ 70° C
065-79EZXMG-H EZX
1550 nm		 DFB Laser 30 dBm 110km *** 3.3 V -40 ~ 85° C

** Maximum distances attainable on multimode Gigabit Ethernet fiber circuits are primarily dependent upon multimode distortion, also known as modal dispersion. Larger aperture fiber optic cable allows more modes to be generated at the launch point; these modes cause the pulse width to spread across a Gigabit Ethernet bit time interval to a point where accurate determination of data (i.e., ones and zeroes) is not possible. These are physical properties that are not specific to this product. These properties also apply to competing products operating in the same frequency spectrum over multimode fiber cable having the same modal bandwidth.

*** Maximum distances attainable on singlemode fiber circuits are dependent upon a circuit’s conditions; i.e., the number of splices and patch panels and the number of bends in the circuit path. For comparison with competing products, please use the Link Power Budget for meaningful comparisons.

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